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A Software Defined Device Provisioning Framework Facilitating Scalability in Internet of Things

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Original languageEnglish
Title of host publicationProceedings of the IEEE 5G World Forum
Number of pages6
ISBN (Electronic)978-1-5386-4982-4
DateAccepted/In press - 21 Apr 2018
DatePublished (current) - 2018
EventIEEE 5G World Forum - , United States
Duration: 9 Jul 201811 Jul 2018
http://ieee-wf-5g.org/

Conference

ConferenceIEEE 5G World Forum
Abbreviated titleIEEE 5G World Forum
CountryUnited States
Period9/07/1811/07/18
Internet address

Abstract

The evolution of communication technologies is growing faster than ever demanding efficient networking operations. 5G will soon be the new generation of telecommunications and it is able to unlock the future design challenges of Internet of Things (IoT). Low latency, deployment scalability, automatic maintenance and high bandwidth are some of the core elements accommodating future efficient IoT deployments.In this paper a novel architecture and implementation based on Software Defined Networking (SDN) principles is presented aiming to solve scalability issues within large IoT deployments. This innovative solution is capable of reducing the latency, improving reliability and the User Experience (UX) within the IoT infrastructure. The proposed framework, named Software Defined Provisioning (SDP) enables scalability within IoT deployments by enhancing the network with plug and play features. Furthermore, the integration of an IoT platform with SDN is enabling the robust dynamic authorization and provisioning of heterogeneous IoT devices. The performance evaluation shows that our proposed framework significantly improves the current provisioning systems and also empowers diverse IoT platforms with a plug-able SDN interface.

Event

IEEE 5G World Forum

Abbreviated titleIEEE 5G World Forum
Duration9 Jul 201811 Jul 2018
CountryUnited States
Web address (URL)

Event: Conference

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  • Full-text PDF (accepted author manuscript)

    Rights statement: This is the author accepted manuscript (AAM). The final published version (version of record) is available online via IEEE at https://ieeexplore.ieee.org/document/8516955 . Please refer to any applicable terms of use of the publisher.

    Accepted author manuscript, 291 KB, PDF document

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