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Link quality and path based clustering in IEEE 802.15.4-2015 TSCH networks

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2017 IEEE Symposium on Computers and Communications (ISCC)
Publisher or commissioning bodyInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (Electronic)9781538616291
ISBN (Print)9781538616307, 9781538616284
DOIs
DateAccepted/In press - 31 Mar 2017
DatePublished (current) - 4 Sep 2017

Abstract

Advance clustering techniques have been widely used in Wireless Sensor Networks (WSNs) since they can potentially reduce latency, improve scheduling, decrease end-to-end delay and optimise energy consumption within a dense network topology. In this paper, we present a novel clustering algorithm for high density IEEE 802.15.4-2015 Time-Slotted Channel Hopping (TSCH). In particular, the proposed methodology merges a variety of solutions into an integrated clustering design. Assuming an homogeneous network distribution, the proposed configuration deploys a hierarchical down-top approach of equally numbered sub-groups, in which the formation of the separate sub-groups is adapted to the network density and the node selection metric is based on the link quality indicator. The presented algorithm is implemented in Contiki Operating System (OS) and several test vectors have been designed in order to evaluate the performance of the proposed algorithm in a COOJA simulation environment. Performance results demonstrate the capability of the clustering structure since compared to the default scheme it significantly improves the energy efficiency up to 35%, packet drops more than 40% as well the packet retransmission rate. Last but not least, the outcome of this study indicates a major increase in the network lifetime, i.e., up to 50%.

    Research areas

  • Internet of things, IEEE 802.15.4-2015, TSCH, Synchronisation, Clustering, Energy Consumption

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  • Full-text PDF (accepted author manuscript)

    Rights statement: This is the author accepted manuscript (AAM). The final published version (version of record) is available online via IEEE at http://ieeexplore.ieee.org/document/8024625/. Please refer to any applicable terms of use of the publisher.

    Accepted author manuscript, 652 KB, PDF-document

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