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Lumped device modeling with FDTD including packaging effects

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationIEEE MTT-S International : Microwave Symposium, 2002
Publisher or commissioning bodyInstitute of Electrical and Electronics Engineers (IEEE)
Pages1139 - 1142
Number of pages4
ISBN (Print)0780372395
StatePublished - Jun 2002
EventIEEE MTT-S International Microwave Symposium - Seattle, United States


ConferenceIEEE MTT-S International Microwave Symposium
CountryUnited States
Period1/06/02 → …


A two-terminal device can be incorporated into FDTD using the Lumped Element FDTD (LE-FDTD) formulation, unfortunately, this method is not able to analyze accurately the packaging effects of the device. This is possible using Lumped Network FDTD (LN-FDTD) - however LN-FDTD requires a complicated pre-calculation for simple devices such as Schottky or varactor diode. Therefore, this paper presents a simple and effective state space approach to incorporate device packaging effects into FDTD algorithm. The new technique is validated by means of experimental measurements of a varactor-tuned patch antenna and the agreement between the predicted and actual responses is shown to be excellent

Additional information

Name and Venue of Event: Seattle, USA Conference Proceedings/Title of Journal: IEEE MTT-S International : Microwave Symposium, 2002 Rose publication type: Conference contribution Sponsorship: The authors wish to thank Professors Bull and McGeehan for provision of facilities at Bristol and EPSRC for sponsoring this work Terms of use: Copyright © 2002 IEEE. Reprinted from IEEE MTT-S International Microwave Symposium, 2002. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Bristol's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to By choosing to view this document, you agree to all provisions of the copyright laws protecting it.


IEEE MTT-S International Microwave Symposium

Duration1 Jun 2002 → …
CountryUnited States

Event: Conference

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