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On the delamination self-sensing function of Z-pinned composite laminates

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On the delamination self-sensing function of Z-pinned composite laminates. / Zhang, Bing; Allegri , Giuliano; Yasaee, Mehdi; Hallett, Stephen; Partridge, Ivana.

In: Composites Science and Technology, Vol. 128, 18.05.2016, p. 138-146.

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@article{6e01809139474f198af725bd30c256e5,
title = "On the delamination self-sensing function of Z-pinned composite laminates",
abstract = "This paper investigates for the first time the usage of through-thickness reinforcement for delamination detection in self-sensing composite laminates. Electrically conductive T300/BMI Z-pins are considered in this study. The through-thickness electrical resistance is measured as the delamination self-sensing variable, both for conductive and non-conductive laminates. The Z-pin ends are connected to a resistance measurement circuit via electrodes arranged on the surface of the laminate. The delamination self-sensing function enabled by conductive Z-pins is characterised for Mode I/II delamination bridging, using single Z-pin coupons. Experiment results show that, if the through-thickness reinforced laminate is electrically conductive, the whole Z-pin pull-out process associated with delamination bridging can be monitored. However, for a non-conductive laminate, delamination bridging may not be sensed after the Z-pin is pulled out from one of the surface electrodes. Regardless of the electrical properties of the reinforced laminate, the through-thickness electrical resistance is capable of detecting Mode II bridging, albeit there exists an initial “blind spot” at relatively small lateral deformation. However, the Z-pin rupture can be clearly detected as an abrupt resistance increase. This study paves the way for exploring multi-functional applications of through-thickness reinforcement.",
keywords = "Structural composites, Smart materials, Delamination, Z-pinning",
author = "Bing Zhang and Giuliano Allegri and Mehdi Yasaee and Stephen Hallett and Ivana Partridge",
year = "2016",
month = "5",
day = "18",
doi = "10.1016/j.compscitech.2016.03.019",
language = "English",
volume = "128",
pages = "138--146",
journal = "Composites Science and Technology",
issn = "0266-3538",
publisher = "Elsevier",

}

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TY - JOUR

T1 - On the delamination self-sensing function of Z-pinned composite laminates

AU - Zhang, Bing

AU - Allegri , Giuliano

AU - Yasaee, Mehdi

AU - Hallett, Stephen

AU - Partridge, Ivana

PY - 2016/5/18

Y1 - 2016/5/18

N2 - This paper investigates for the first time the usage of through-thickness reinforcement for delamination detection in self-sensing composite laminates. Electrically conductive T300/BMI Z-pins are considered in this study. The through-thickness electrical resistance is measured as the delamination self-sensing variable, both for conductive and non-conductive laminates. The Z-pin ends are connected to a resistance measurement circuit via electrodes arranged on the surface of the laminate. The delamination self-sensing function enabled by conductive Z-pins is characterised for Mode I/II delamination bridging, using single Z-pin coupons. Experiment results show that, if the through-thickness reinforced laminate is electrically conductive, the whole Z-pin pull-out process associated with delamination bridging can be monitored. However, for a non-conductive laminate, delamination bridging may not be sensed after the Z-pin is pulled out from one of the surface electrodes. Regardless of the electrical properties of the reinforced laminate, the through-thickness electrical resistance is capable of detecting Mode II bridging, albeit there exists an initial “blind spot” at relatively small lateral deformation. However, the Z-pin rupture can be clearly detected as an abrupt resistance increase. This study paves the way for exploring multi-functional applications of through-thickness reinforcement.

AB - This paper investigates for the first time the usage of through-thickness reinforcement for delamination detection in self-sensing composite laminates. Electrically conductive T300/BMI Z-pins are considered in this study. The through-thickness electrical resistance is measured as the delamination self-sensing variable, both for conductive and non-conductive laminates. The Z-pin ends are connected to a resistance measurement circuit via electrodes arranged on the surface of the laminate. The delamination self-sensing function enabled by conductive Z-pins is characterised for Mode I/II delamination bridging, using single Z-pin coupons. Experiment results show that, if the through-thickness reinforced laminate is electrically conductive, the whole Z-pin pull-out process associated with delamination bridging can be monitored. However, for a non-conductive laminate, delamination bridging may not be sensed after the Z-pin is pulled out from one of the surface electrodes. Regardless of the electrical properties of the reinforced laminate, the through-thickness electrical resistance is capable of detecting Mode II bridging, albeit there exists an initial “blind spot” at relatively small lateral deformation. However, the Z-pin rupture can be clearly detected as an abrupt resistance increase. This study paves the way for exploring multi-functional applications of through-thickness reinforcement.

KW - Structural composites

KW - Smart materials

KW - Delamination

KW - Z-pinning

UR - http://www.scopus.com/inward/record.url?scp=84962224909&partnerID=8YFLogxK

U2 - 10.1016/j.compscitech.2016.03.019

DO - 10.1016/j.compscitech.2016.03.019

M3 - Article

VL - 128

SP - 138

EP - 146

JO - Composites Science and Technology

T2 - Composites Science and Technology

JF - Composites Science and Technology

SN - 0266-3538

ER -