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Results from the CBC3 readout ASIC for CMS 2S-modules

Research output: Contribution to journalReview article

Original languageEnglish
Pages (from-to)175-180
Number of pages6
JournalNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume924
Early online date1 Oct 2018
DOIs
DateAccepted/In press - 13 Sep 2018
DateE-pub ahead of print - 1 Oct 2018
DatePublished (current) - 21 Apr 2019

Abstract

The CBC3 is the latest version of the CMS Binary Chip for readout of the outer radial region of the upgraded CMS Tracker at the High Luminosity LHC. This 254-channel, 130nm CMOS ASIC is designed to be bump-bonded to a substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, containing two overlaid silicon microstrip sensors, aligned with a parallel orientation. On-chip logic identifies Level-1 trigger primitives from high transverse-momentum tracks by selecting correlated clusters in the two sensors. The CBC3 was delivered in late 2016; wafer probing and performance tests have been carried out. Several prototype modules using the CBC3 have been produced and tested in the lab and in different beams. The results show that the CBC3 satisfies CMS requirements and only small corrections are needed for the final version of the chip for production.

    Research areas

  • ASIC electronics, HL-LHC, Silicon microstrips, Tracking detectors, Trigger

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    Rights statement: This is the final published version of the article (version of record). It first appeared online via Elsevier at https://doi.org/10.1016/j.nima.2018.09.051 . Please refer to any applicable terms of use of the publisher.

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    Licence: CC BY

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